Fully Automatic Film Laminating Machine

It is suitable for the lamination process in MLCC roll-to-roll production. After the number of layers is edited as required, electrode sheets are positioned, cut, peeled, position-corrected and laminated to form multi-layer ceramic substrates.

Product Category: Intelligent Equipment Division
Chip Capacitor/Inductor/Resistor Production Line Equipment

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Detailed Description

Technical Parameters:

Conveying film width350mm
Peeling size310x310mm
Image alignment accuracy5um
Lamination cycleFastest 9s/cycle (incl. 2s main pressing)
Maximum lamination layers1000 layers; ±10um accuracy for 300-layer products
Peeling platform flatness≤10um
Main pressing pressure rangeMax 80Ton, Min 13Ton (adjustable)
Overall dimensionsApprox. 4350x1600x2500 (LxWxH) mm

Technical Features:

1. Roll-to-roll dual-position suction lamination technology enables lamination of different films with fast process transfer.

2. Non-destructive film peeling control technology achieves damage-free film peeling.

3. High-precision alignment lamination control technology ensures precise alignment detection and consistent lamination.

4. Servo high-pressure uniform pressing control technology achieves uniform pressing and precise pressure.

5. Intelligent system control technology ensures stable system operation.